Powering Next‑GenAI Computingfrom Edge to Cloud
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Edge to Cloud, All on WoW
Our Wafer-on-Wafer platform unifies edge and cloud compute with a single, scalable 3D integration architecture.
WoW Unleashes Edge Intelligence
Bringing data-center-class bandwidth to constrained edge environments. Our WoW platform enables AI inference at the edge with minimal power overhead.
WoW Empowers Cloud Computing
Scaling HPC and AI workloads with large bandwidth improvements. From accelerator chips to network devices, WoW drives cloud compute forward.
Solutions & Services
From chip design to mass production — complete 2D, 2.5D, and 3D solutions.
Compute
High-performance compute chips spanning AI accelerators, video processing, eFPGA, crypto mining, and RISC-V SoCs.
Networking
High-speed networking silicon — low-latency switches and signal-integrity retimers for data center and edge.
Custom
End-to-end ASIC turnkey service and WoW 3DIC custom design — from SPEC to mass production across 2D, 2.5D, and 3D.
Why WHALECHIP
Every WHALECHIP product, solution, and custom design is meticulously engineered — from foundational IP to system-level architecture — to support the most demanding workloads. Our silicon designs integrate advanced 3D heterogeneous stacking technology to increase memory bandwidth while reducing latency and power consumption. Leveraging these IPs, our hardware delivers the compute and memory resources required for high-speed AI/HPC communication, ensuring seamless operation across both Edge and Cloud high-performance computing environments.
Market Applications
WoW 3DIC technology powers breakthroughs across every compute-intensive domain.
Data Center
HBM alternatives with WoW for next-gen AI accelerators and scale-out infrastructure.
Edge AI
Ultra-low power WoW DRAM Buffer Die for on-device inference and vision processing.
Automotive
Reliable 3D stacked memory and compute for autonomous driving SoCs.
HPC
Extreme bandwidth solutions enabling petaflop-class scientific computing.
Blockchain
Custom ASIC mining chips (SHA256, EThash) with industry-leading power efficiency.
Ready to Power Your Next-Gen AI?
Partner with the world's first company to mass-produce 3D WoW Logic+DRAM technology. Let's build the future of AI computing together.