About WHALECHIP
IC design and WoW 3DIC turnkey service provider — powering next-gen AI computing, from Edge to Cloud.
World's First Mass-Production 3D WoW
Founded in 2017 and headquartered in Taipei, Taiwan, WHALECHIP CO., LTD. is a system integration solution provider specializing in advanced Wafer-on-Wafer (WoW) 3DIC technology and high-performance computing (HPC) ASICs/SoCs. Our core team brings deep expertise in Fabless IC design, foundry collaboration, and system-level integration across the semiconductor and OEM/ODM sectors, with offices in Taipei (Business & R&D), Hsinchu (R&D), and Cupertino, CA (Business).
WHALECHIP is the world's first company to achieve mass production of 3D hybrid WoW technology. In close collaboration with TSMC, we deliver innovative chip integration solutions that directly connect high-bandwidth memory with logic cores — driving disruptive innovation in AI and HPC for the post-Moore's Law era.
- Collaborating with TSMC on 3D WoW technology since 2020; officially became a direct client in 2021
- Actively involved in TSMC's SOIC-X-WoW project and 2.5D CoWoS advanced packaging initiatives
Our Team
Thomas Tsai
Chairman & CEO
20+ years in semiconductor investment & management. Multiple cross-border M&A and US IPO experience. M.S. Industrial Engineering, University of Wisconsin-Madison.
Wen Chen
CTO
25+ years in GPU design, AI, and machine learning R&D. Led AMD technical team delivering 9 chips from tape-out to mass production. M.S. Electrical Engineering, Cornell University.
Bill Hsia
CFO
20+ years in accounting, financial analysis, account implementation, and cost planning. MBA, National Chengchi University.
James Lee
COO
20+ years in operations and supply chain management. Taipei City University of Science and Technology, Computer Engineering.
Eric Lee
VP of Advanced R&D
15+ years in IC design, SRAM design, CIM, and 3D heterogeneous stacked chip R&D. M.S. Electrical Engineering, National Chung Hsing University.
Alex Yang
VP of Business Development
15+ years in foundry PIE/PE, device R&D, and semiconductor market analysis. MBA, University of Southampton; M.S. Electrical Engineering, NTNU.
The WHALE Philosophy
Five core values that drive us to build world-class silicon technology.
Wisdom
Exceptional knowledge to solve complex design challenges.
Honesty
Highest standard of products and services, transparent and honest.
Agility
Flexible, respond quickly, continue to innovate.
Leadership
Leaders in WoW 3DIC technology.
Excellence
Constantly challenging ourselves, committed to excellent technology.
Strategic Partners
Direct account — advanced node manufacturing, CoWoS packaging.
Advanced packaging partnership and strategic investor in WHALECHIP.
Our Journey
WHALECHIP Founded in Taipei, Taiwan — October 2017
First 7nm SHA256 ASIC Successfully Taped-Out
7nm ASIC mass production, shipment reached 11KK pcs
First WoW 3DIC (Gen1) Tape-Out
First WoW 3DIC (Gen1) Sample-Out
Mass production of first WoW 3DIC (W1) — World's first 3D WoW mass production
Second WoW 3DIC (Gen2) tape-out. Became TSMC Direct Account.
Second WoW 3DIC (Gen2) silicon proven
Mass production of second WoW 3DIC (W2)
Launch of Accelerator & SOC Design Service
First 2.5D CoWoS-S Tape-Out. Silicon validation completed.
7nm 2.5D CoWoS chips mass production. WoW 3DIC Platform launch.
Patent Achievements
WHALECHIP holds 50+ patents in our broader intellectual property portfolio, with 30+ patents specifically in WoW (Wafer-on-Wafer) 3DIC technology — realizing this innovation ahead of global manufacturers and leading the industry in production-stage yield optimization.
WoW Technology
Worldwide pioneer in WoW (Logic + DRAM) 3DIC mass production.
Patents Filed
Broad intellectual property portfolio across chip design and integration.
3DIC Architecture
Core patents in heterogeneous integration designs.
Quality Certification
ISO 9001:2015
Quality Management System
Design and manufacture management of integrated circuits (ICs)
Let's Build Together
Ready to explore what WoW 3DIC can do for your next project?