Products & Solutions

End-to-end chip solutions from design to mass production.

Custom ASIC, 3D IC and System design services tailored to your needs.

ASICFull-turnkey ASIC design and manufacturing services.

4nm~60nm, FE/BE design, MPW/MP/COT, CP/FT testing.

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Interposer design, substrate design, SI/PI thermal simulation, material flow management.

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6/12/22nm WoW design, FE/BE WoW design, 3D memory/controller IP, high bandwidth memory plan.

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WoW 3DIC SolutionsWafer-on-Wafer 3D IC platform and services.

WoW DRAM Buffer Die, WoW DRAM Controller & IP, 3DNocSRAM, 3DeFPGA. Compatible with TSMC process nodes.

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System Designhardware, firmware, software, and thermal/mechanical design support

Custom Design

Need a Custom Solution?

Our engineering team delivers end-to-end ASIC and 3D IC design services — from specification to mass production on TSMC advanced nodes.