MILESTONE
2025
- Q2 WoW 3DIC Platform
2024
- Q2 First 2.5D Product Delivered
2023
- Q1 Mass production of WHALECHIP’s second WoW 3DIC (W2)
- Q2 Launch of Accelerator & Desing Service (SOIC-X-W2.5D CoWoS)
2022
- Q1 Second WoW 3DIC (Gen2) tape-out
- Q2 Second WoW 3DIC (Gen2) silicon proven
2021
- Q3 Mass production of WHALECHIP’s first WoW 3DIC (W1),
2020
- Q2 First WoW 3DIC (Gen1) Sample-Out
2019
- Q3 7nm ASIC mass production and shipment
reached 11KKPcs - Q4 The first WoW 3DIC (Gen1) Tape-Out
2018
- Q3 First 7nm SHA256 ASIC — Successfully Taped-Out
2017
- Q3 WHALECHIP Founded in Taipei, Taiwan — October 2017
Patent Achievements
PATENT
WHALECHIP WoW (Wafer-on-Wafer) patent portfolio has accumulated more than 30 patents.Realizing the 3DIC WoW technology ahead of global manufacturers. Taking the lead in improving the yield rate in the production stage, patent portfolio and design challenges solutions.