Whale Done for Next-Gen Chip Design
Founded in 2017 and headquartered in Taipei, Taiwan, WHALECHIP CO., LTD. is a system integration solution provider dedicated to technological innovation. We specialize in advanced Wafer-on-Wafer (WoW) 3DIC technology and high-performance computing (HPC) ASICs /SoCs, delivering comprehensive system-level integration solutions.
With extensive industry experience, our core team brings deep expertise in Fabless IC design, foundry collaboration, and system-level integration in the semiconductor and OEM/ODM sectors.
We are committed to driving disruptive innovation in the AI and HPC, accelerating progress in the post-Moore's Law era, and leading the evolution of next generation 3DIC technologies. As large language models (LLMs) and high-performance computing applications rapidly expand, we actively track industry trends and strategically position ourselves in emerging high-impact markets.
WHALECHIP is the world's first company to achieve mass production of 3D hybrid WoW technology. In close collaboration with TSMC, we deliver innovative chip integration solutions that directly connect high-bandwidth memory with logic cores.
With extensive industry experience, our core team brings deep expertise in Fabless IC design, foundry collaboration, and system-level integration in the semiconductor and OEM/ODM sectors.
We are committed to driving disruptive innovation in the AI and HPC, accelerating progress in the post-Moore's Law era, and leading the evolution of next generation 3DIC technologies. As large language models (LLMs) and high-performance computing applications rapidly expand, we actively track industry trends and strategically position ourselves in emerging high-impact markets.
WHALECHIP is the world's first company to achieve mass production of 3D hybrid WoW technology. In close collaboration with TSMC, we deliver innovative chip integration solutions that directly connect high-bandwidth memory with logic cores.
- Collaborating with TSMC on 3D WoW technology since 2020, and officially became a direct client in 2021
- Actively involved in TSMC's SOIC-X-WoW project and 2.5D CoWoS advanced packaging initiatives