WoW 3DIC Turnkey Design Services
Chip design/production (yield improvement)/package (substrate & package design)/SLT test (system carrier development)
WHALECHIP provides customers with a complete set of integrated design verification services for WoW 3DIC technology, including chip architecture, design, testability, back-end services (Partner) and thermal imitation model solutions to system-level (SLT) verification, combined with Fab resources to satisfy customers various needs from engineering verification of 3D chip architecture to mass production
WHALECHIP provides customers with a complete set of integrated design verification services for WoW 3DIC technology, including chip architecture, design, testability, back-end services (Partner) and thermal imitation model solutions to system-level (SLT) verification, combined with Fab resources to satisfy customers various needs from engineering verification of 3D chip architecture to mass production